IPC Day Aero-Mil Toulouse – 4-5 June 2025

Wednesday 4 June 13:00-17:00 and Thursday 5 June 9:00-13:00

Day 1 (afternoon session) – Wednesday 4 June 

Welcome Address : 
•    Airbus DS - Pierre-Emmanuel Goutorbe, & IPC – Sanjay Huprikar

Keynote
·      Alison James – Update advocacy
·      Airbus DS-Defense & Space - Oscar Vazquez Chiclana

Session 1 – Connectors & High-speed Connectivity
A technical session where industry leaders and experts will dive into the latest innovations, challenges, and design strategies for connectors-to-board, including high-speed connectivity technology.

Presentations will cover common use cases in aerospace/automotive areas addressing technical challenges and solutions, e.g., signal integrity and mechanical reliability. Industry experts are going to address best design practices, such as those applicable to printed board and wire harness design in relation to connector selection. 

Q&A sessions will be held after each technical session to enhance discussion on industry challenges and needs in standardization.

Confirmed speakers include : Airbus Patrick Rainjonneau, ODU Jonathan Milteau,  Considered speakers may include Thales, Amphenol, AXON, C&K, Radiall, FCI, Smith Interconnect, Positronic, Glenair France... 

Networking Dinner

Day 2 (morning session) – Thursday 5 June (9-13)

Session 2 – Press-fit Technologies Deep Dive
A team of industry experts with multi decade experience in designing, materials, manufacturing, process quality and acceptability, reliability of the interconnection, as well as the fundamental physical mechanisms will draw a holistic picture of press-fit technology.

The presentations include the Press-fit pin itself, PCB and PCBA, as well as the connector part. Quality and reliability will be discussed with an extensive automotive background. Following the presentation part, the speakers are happy to discuss questions around space requirements, surface finishes, and any other topics around the press-fit interconnection. Basis for the session will be the IPC-9797A standard and the IPC-HDBK-9798 handbook. The A version of the handbook will include a rework section.

Confirmed speakers include : Continental François Le Rest, Bosch Philippe Jaeckle, Uibel consulting Frank Uibel, EPT Hermann Eicher  

Hotel room in Toulouse for IPC Day participants

Toulouse is under quite high hotel room pressure during this period and IPC is holding a roomblock of 15 rooms available for IPC Day participants at Aparthotel Adagio Toulouse Centre Ramblas (located nearby the conference venue). 

These rooms are available for checkin 4 June and checkout 5 June at the price of 196 EUR per night (excluding. breakfast). They are to be paid onsite at checkin time and need to be attributed to participants by Thursday 29 May at the very latest. 

In case you would like to get one of these rooms for your own use, please send a written request including guest first name, last name and checkin/checkout date to [email protected]. 

Upon receipt, a confirmation will be returned to you to confirm that the room is yours. Please note that any cancellation received after 29 May will bear 100% cost. 
 

Sponsorship Packages are available for the workshop on Component-to-System Level Packaging - Addressing Integration Challenges for Automotive and Industrial Applications.

Registration is now open to attend the workshop. Be Part of the Solution - The workshop is intended to bring together industry experts presenting and discussing CLP and SLP trends, requirements, challenges, solutions, and the needs for guidelines/standards desired for design, assembly, test, reliability, and manufacturing solutions (EMS) perspective.

Advanced Packaging to System Integration – Trends and Challenges
 

Speaker:
Dr. Devan Iyer, Chief Strategist, Advanced Packaging, IPC
 

Date & Time:
Tuesday, July 9, 2025
8:30 AM – 9:15 AM (Mountain Time)
 

Location:
3D-PEIM 2025
Golden, Colorado

The future of electronics isn’t just about smaller chips—it’s about smarter integration. In this keynote plenary, Dr. Devan Iyer will explore how advanced packaging technologies such as 2.5D/3D, fan-out, and heterogeneous integration are enabling next-generation applications in data centers, 5G/6G, autonomous systems, IoT, and AR/VR.
The session will also address critical challenges in chip-package-PCB co-design and highlight the materials, processes, and integration strategies shaping the systems of tomorrow.

More Information & Registration:
https://www.3d-peim.org/
 

We are delighted to welcome Adrian Harea of Schaeffler and Michael Schleicher of Semikron-Danfoss to lead a discussion on DfM for EV's high-voltage / high-power applications.

The panel will share techniques for addressing the complexity of components, increased integration, 3D assembly and working with heavy assemblies. They will touch on the constraints of final systems that impact size, weight, configuration and shape. Balancing easy to manufacture with cost and quality is a key backdrop for the discussion. Panelists will present board level and final assembly DFM considerations. 

Our "Road to Reliability" series aims to bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. We will examine reliability drivers, technology applications, and target lifecycles.

Join us for this informative session to better understand technology gaps, broaden your professional connections, and uncover strategies for meeting reliability objectives.

Moderator: Stanton Rak, SF Rak Company

AI and IPC standards empower future factories - building a new smart manufacturing ecosystem.

IPC Taiwan Member Appreciation Dinner

We can’t wait to welcome you to IPC Builds, September 13-18, 2025 at the Embassy Suites by Hilton Denton Convention Center in Denton, Texas.

 REGISTER | AGENDA | COMMITTEE MEETINGS | CONTACT US | HOTEL & LOCATION

IPC Builds is all about IPC Standards, welcoming your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors. Newcomers and industry veterans are welcome. Participate and learn more about these critical industry documents.

IPC Standard Development Committees cover a range of topics, including:

The IPC CEMAC (China Electronics Manufacturing Annual Conference), an exclusive event for IPC members, is dedicated to advancing the development and collaboration of the electronics industry. The conference focuses on promoting the adoption and dissemination of quality and technical standards in electronics manufacturing while serving as a high-value, professional, and efficient platform for international exchange built around IPC’s global industry standards.

To enhance international collaboration and drive sustainable development in electronics manufacturing, IPC CEMAC 2025 will center on the theme "Shaping a Sustainable Future." The event invites participants to explore ways to achieve sustainability through technological innovation, efficient resource utilization, and improved production processes. It seeks to promote green, smart manufacturing and effective supply chain management while embedding sustainability into all aspects of electronics manufacturing, supporting the industry’s long-term, healthy growth.

Electronics Manufacturing & Packaging Symposium (EMPS) 2025

Location: 

ESA/ESTEC 

Noordwijk, the Netherlands

Date: 6–9 October 2025

Technical Presentations 

Professional Development Courses

Exhibition

The symposium, organised by the European Space Agency in partnership with IPC will focus on the latest developments in printed circuit boards, electronic assembly and packaging technologies. While space applications remain a core focus, the event also covers high-reliability market segments such as defense, automotive, medical and data infrastructure, which are central to Europe’s electronics manufacturing industry.

This competition is for choosing the Japanese champion to dispatch the world final 2025 with the cooperation of Japan Unix Co., Ltd. Preliminary details (mid-July & August) will be announced around June in their website. And then, only who pass the preliminary is invited to the final at NEPCON NAGOYA (Oct. 29 - 31).

NEPCON NAGOYA is the exhibition held in the center of the manufacturing industry of Japan. Nagoya is a capital city of Aichi prefecture which has Japan's largest automotive-related manufacturing industry cluster. IPC Japan will have its booth and have Japan regional final of IPC hand soldering competition 2024.